| 摘要 |
PROBLEM TO BE SOLVED: To improve the junction reliability of solder joining portions of the inside and outside of a semiconductor device while improving heat dissipation performance on heat dissipating surfaces of a plurality of semiconductor structures different in mounting height in a semiconductor device having the semiconductor structures. SOLUTION: Thermal conductivity elastic bodies 8, 9 are provided for each of a plurality of LSI packages 2, 3 mounted on a system-in package 1, the elastic modulus of the thermal conductivity elastic body 8 provided on a heat dissipation surface 2B of the LSI package 2 having a low mounting height is set higher than the elastic modulus of the thermal conductivity elastic body 9 provided on a heat dissipation surface 3B of the LSI package 3 having high mounting height, and the thickness of the thermal conductivity elastic body 8 is larger than that of the thermal conductivity elastic body 9. With this configuration, a load 35 can be substantially uniformly applied to all the thermal conductivity elastic bodies 8, 9 of the mounted LSI packages 2, 3, and heat generated in the LSI packages 2, 3 can be dissipated without impairing heat dissipation performance. COPYRIGHT: (C)2009,JPO&INPIT
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