| 摘要 |
<p>A heat sink, an electronic device, and a method of manufacturing the electronic device are provided. In the heat sink having a base thermally connected to a semiconductor chip and radiation fins, the radiation fins disposed at a central position where the heat transfer temperature from the semiconductor chip is high are made to be longer in its length, and the other radiation fins are made to be gradually shorter with the heat transfer temperature is lower. Each of the heat transfer fins includes a vertical part vertically extending from the base and a horizontal part bent at substantially right angle outward from the vertical part.</p> |
