发明名称 |
SEMICONDUCTOR PACKAGE STRUCTURES |
摘要 |
A semiconductor structure includes a plurality of solder structures between a first substrate and a second substrate. A first encapsulation material is substantially around a first one of the solder structures and a second encapsulation material is substantially around a second one of the solder structures. The first one and the second one of the solder structures are near to each other and a gap is between the first encapsulation material and the second encapsulation material.
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申请公布号 |
US2008308932(A1) |
申请公布日期 |
2008.12.18 |
申请号 |
US20070761722 |
申请日期 |
2007.06.12 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LII MIRNG-JI;LEE HSIN-HUI |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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