发明名称 |
SOLID STATE IMAGING DEVICE, ITS MANUFACTURING METHOD, AND IMAGING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To simultaneously realize a sufficient hole accumulation layer and a dark current reduction. <P>SOLUTION: A solid state imaging device 1 includes a light reception unit 12 which performs photoelectric conversion of an incident light. The solid state imaging device 1 has a film 21 formed on a light reception surface 12s of the light reception unit 12 so as to lower the interface state and a film 22 formed on the film 21 to lower the interface state and having a negative fixed charge. A hole accumulation layer 23 is formed on the light reception surface 12s of the light reception unit 12. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008306154(A) |
申请公布日期 |
2008.12.18 |
申请号 |
JP20070265287 |
申请日期 |
2007.10.11 |
申请人 |
SONY CORP |
发明人 |
OSHIYAMA ITARU;ANDO TAKASHI;HIYAMA SUSUMU;YAMAGUCHI TETSUJI;OGISHI HIROKO;IKEDA HARUMI |
分类号 |
H01L27/146;H01L27/148;H01L31/00;H01L31/10;H04N5/335;H04N5/361;H04N5/369 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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