发明名称 SOLID STATE IMAGING DEVICE, ITS MANUFACTURING METHOD, AND IMAGING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To simultaneously realize a sufficient hole accumulation layer and a dark current reduction. <P>SOLUTION: A solid state imaging device 1 includes a light reception unit 12 which performs photoelectric conversion of an incident light. The solid state imaging device 1 has a film 21 formed on a light reception surface 12s of the light reception unit 12 so as to lower the interface state and a film 22 formed on the film 21 to lower the interface state and having a negative fixed charge. A hole accumulation layer 23 is formed on the light reception surface 12s of the light reception unit 12. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008306154(A) 申请公布日期 2008.12.18
申请号 JP20070265287 申请日期 2007.10.11
申请人 SONY CORP 发明人 OSHIYAMA ITARU;ANDO TAKASHI;HIYAMA SUSUMU;YAMAGUCHI TETSUJI;OGISHI HIROKO;IKEDA HARUMI
分类号 H01L27/146;H01L27/148;H01L31/00;H01L31/10;H04N5/335;H04N5/361;H04N5/369 主分类号 H01L27/146
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