| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing device with reduced resin flow at the time of compression; and its method. SOLUTION: A plurality of semiconductor chips 115 arranged on different planar positions are placed in a cavity 105. The resin sealing device supplies resin into the cavity 105 before compression molding. The cavity 105 is virtually split in predetermined sections in a plane vision of the cavity 105. The resin is partition-controlled so as to correspond to the predetermined sections 120-123 in plan view of the cavity 105. An amount of the partition-controlled resin 110-113 is determined based on the number of mounted semiconductor chips 115 corresponding to the sections 120-123. COPYRIGHT: (C)2009,JPO&INPIT |
