RESIN SEALING DEVICE AND RESIN SEALING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mold for compression molding capable of high-quality molding. SOLUTION: A compression-type resin sealing device 100 is capable of forming a closed space M by abutting an upper mold 110 and a lower mold 130, and at least a part of the closed space M composes a cavity 138. The device is equipped with a vacuum circuit 170 capable of decompressing inside the closed space M. The vacuum circuit 170 is composed to be able to switch between a first pressure lower than the atmospheric pressure and a second pressure lower than the atmospheric pressure and higher than the first pressure. COPYRIGHT: (C)2009,JPO&INPIT