发明名称 CPU Heat Sink Mounting Method And Apparatus
摘要 A system and method for mounting a heat sink associated with an electronics component are disclosed. The disclosure provides a method including connecting a CPU support bracket to a board using one or more support bracket connectors, mounting a CPU to the CPU support bracket, and mounting a heat sink assembly to the CPU support bracket using one or more heat sink connectors configured to mate with the one or more support bracket connectors. The disclosure also provides a method for mounting a heat sink assembly associated with a CPU, including removing one or more socket screws installed at one or more corners of a socket disposed in a board, installing one or more support bracket connectors configured to mate with respective holes in the board, and mounting a heat sink assembly to the support bracket connectors using one or more heat sink connectors configured to mate with the one or more support bracket connectors. The disclosure also provides a system for mounting an electronic component and associated heat sink to a board, including a support bracket operable to retain an electronic component and provide at least one electrical connection between a board and the electronic component, a support bracket connector configured to releasably connect the support bracket to the board, and a heat sink connector configured to releasably connect a heat sink with the support bracket connector.
申请公布号 US2008310118(A1) 申请公布日期 2008.12.18
申请号 US20070764424 申请日期 2007.06.18
申请人 DELL PRODUCTS L.P. 发明人 BROCKLESBY BRANDON JOEL;GONZALEZ JUAN MANUEL;REGIMBAL LAURENT ANDREW
分类号 H05K7/20 主分类号 H05K7/20
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