| 摘要 |
<p>A photoresist resin composition, and a method for forming a pattern by using the composition are provided to improve the adhesion to a substrate and to obtain a high aspect ratio and a thick film thickness. A photoresist resin composition comprises diphenyl sulfone or its derivatives as an adhesion enhancer. Preferably the adhesion enhancer comprises a diphenyl sulfone derivative whose at least one hydrogen atom is substituted with an amino group, a nitro group, a hydroxyl group, a carboxyl group, a fluorine atom, a chlorine atom or an acid anhydride.</p> |
