| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging device whose heat generated by an imaging elements and a control IC can be effectively cooled by using a heat pipe and besides whose easiness in a assembling process, compact and low-profile form can be realized. <P>SOLUTION: The imaging device 1 is so structured as to thermally combine an imaging element 5 mounted on a printed-circuit board 3, an imaging element supporting member 4 which supports the imaging element 5 and is arranged on a shield plate 27, and a heat pipe 12 including an evaporator 12a arranged in the imaging device 5. In the imaging device 1, between the imaging element supporting member 4 and the imaging element 5, there is provided a heat sink of the evaporator 12a between a pair of terminal arrays 5a of the imaging element 5 terminal-connected with the printed-circuit board 3. Further, an imaging element supporting depression 4a is arranged to which the evaporator is fixed and besides positioning pins 7, 8 in relation to an imaging lens and the printed-circuit board 3 are provided in the imaging element supporting member 4. <P>COPYRIGHT: (C)2009,JPO&INPIT |
