| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroconductive adhesive forming a conduction connection part at relatively low temperature, wherein, in the case that abnormal current is caused to flow after the formation of a conduction connection part, the conduction connection part functions as a protective device for a circuit, for reducing or cutting-off electric conduction. <P>SOLUTION: The electroconductive adhesive contains at least shape memory alloy filler particles as an electroconductive filler component in addition to a resin component. Further, a conduction connection part formed by curing the electroconductive adhesive exhibits low resistance in the case of less than a prescribed temperature range, but exhibits high resistance when temperature reaches the prescribed temperature range or exceeds the same temperature range. <P>COPYRIGHT: (C)2009,JPO&INPIT |
