SUBSTRATE FOR POWER MODULE AND MANUFACTURING METHOD THEREOF, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a power module which has respective circuits in a circuit layer excellently insulated and can be made compact and inexpensive, to provide a manufacturing method thereof, and to provide the power module. SOLUTION: The substrate for the power module has the circuit layer 2a formed on a top surface of a ceramic substrate 1 by etching an aluminum layer 2 bonded thereupon, and is characterized in that the circuit layer 2a contains 0.7 to 1.2 wt.% Si within a range of≤200μm from its bonding interface 6 with the ceramic substrate 1. COPYRIGHT: (C)2009,JPO&INPIT