发明名称 HOUSING OF COMPACT ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To attain the improvement of stiffness and strength of a housing, while making the manufacture of the housing easy, withholding the cost as low as possible. SOLUTION: Stainless spring steel plate is adopted as the material of a housing 1, an outer shaped body 2 formed into a predetermined outer shape of the housing 1 with the stainless spring steel plate, and an inner shaped body 3 formed in to a predetermined inner shape of the housing 1 with the stainless spring steel plate are laminated mutually so as to be closely attached state. By the two laminated structure of the shaped bodies 2, 3, whole of the housing 1 is formed to be thin and compact being made to have toughness. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008305929(A) 申请公布日期 2008.12.18
申请号 JP20070151066 申请日期 2007.06.07
申请人 KIKUCHISEISAKUSHO CO LTD 发明人 KIKUCHI ISAO
分类号 H05K5/02 主分类号 H05K5/02
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