| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for peeling sheet that peels off a sheet attached on a plate-like member, without deteriorating the plate-like member, such as a semiconductor wafer. SOLUTION: A sheet-peeling device peels off a protection sheet F attached on a semiconductor wafer W by using an adhesive tape T. A thermo-sensitive adhesive tape is used as the adhesion tape T. The adhesion tape T is thermo-compressed onto the protection sheet F by a heater tool. Thereafter, the adhesion tape T is cut by a cutter blade, with a heater cutter portion and a tape delivery portion being raised, the adhesive tape T being gripped by a peeling head 400, the peeling head 400 being moved and the protection sheet F being pulled and peeled off. The peeled protective sheet F is discarded, together with the adhesive tape T into a discard box. COPYRIGHT: (C)2009,JPO&INPIT |
