| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high density thin line mounting structure and a manufacturing method of the structure. <P>SOLUTION: The high density thin line mounting structure is provided with a first semiconductor element arranged on a super-thin line circuit layer, an insulating layer on a phase identification plane, an outer layer circuit layer above the first semiconductor element and a solder mask bottom on the outer layer circuit layer. The solder mask bottom is set to be a connection pad, and it can electrically be connected to a second semiconductor element. The exposed super-fine line circuit layer is set to be a solder ball pad with which a solder ball is filled. In the method, the super-thin line circuit layer can be formed by electrolytic plating without depending on an etching means, and a carrier object and a metal avoiding layer, which are required for forming the super-thin line circuit layer, are removed during a manufacture process or when it is terminated. A space of layout is enlarged and a purpose of high density is realized. <P>COPYRIGHT: (C)2009,JPO&INPIT |
