发明名称 METHOD AND DEVICE FOR REMOVING CONDUCTIVE METAL-OXIDE THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a method and device capable of removing a conductive metal-oxide thin film approximately across-the-board. SOLUTION: A positive electrode 14 and a negative electrode 15 of porous body are arranged in sequence through an insulator 17 in a moving direction of a base material 11 so as to face to the conductive metal-oxide thin film 12 on the surface of the base material 11. The negative electrode 14 is contacted with the conductive metal-oxide thin film 12, and an electrolyte 13 is interposed between the both electrodes 14, 15 and the conductive metal-oxide thin film 12, then a voltage is applied between the both electrodes 14, 15 to remove the conductive metal-oxide thin film 12 with the reductive reaction by moving the base material 11. On this occasion, the electrolyte 13 is supplied in the direction opposite to the direction from the positive electrode 14 to the negative electrode 15 to remove the air bubble on the surface of the base material 11 generated by the reductive reaction. The air bubble on the surface of the positive electrode 14 and in the electrolyte 13 is aspirated from the back surface aide of the positive electrode 14. The unreduced conductive metal-oxide thin film left at the back end part in the moving direction of the base material can be decreased, and a machining speed can be accelerated. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008305910(A) 申请公布日期 2008.12.18
申请号 JP20070150628 申请日期 2007.06.06
申请人 HITACHI ZOSEN CORP;HITZ HI-TECHNOLOGY:KK 发明人 SUGIO TAKESHI;SUNAYAMA KAZUYUKI;SUGIMOTO TAKANOBU
分类号 H01L21/3063;C03C23/00;C25F1/00;C25F7/00 主分类号 H01L21/3063
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