METALLIZED SUBSTRATE AND PROCESS FOR PRODUCING THE SAME

摘要

This invention provides a metallized substrate having a novel structure. The metallized substrate comprises a ceramic substrate, a high-melting point metal layer provided on the ceramic substrate, and a substrate nickel plating layer, a layered nickel-phosphorus plating layer, a diffusion preventive plating layer, and a gold plating layer provided in that order on the high-melting point metal layer. The substrate nickel plating layer is a nickel metal plating layer, a nickel-boron plating layer, or a nickel-cobalt plating layer. The diffusion preventive plating layer is a columnar nickel-phosphorus plating layer, a palladium-phosphorus plating layer, or a palladium metal plating layer. According to the above constitution, even after heating in mounting a semiconductor chip, good bond strength of wire bonding can be realized.