| 摘要 |
In accordance with the present invention, a thermally-efficient metal core printed circuit board comprises a metal base (66) including opposing first face and a second face, and the said faces with a plurality of dispersed dielectric (55) or insulating layer selectively fabricated overlying the metal base (66) resulting in a planar surface for the overlying circuitries, a plurality of dispersed thermal metallization layer connected directly to the metal base (66) for optimum thermal performance and a plurality of electrical circuitries connected accordingly to the profile of the metal body for the multi-layer electrical circuit connectivity. The selective dielectric (55) or insulation layer configuration allows direct thermal pad contact to the bulk metal base (66) and insulation for the electrical terminals resulting in high thermal-efficient circuit board for single, matrix, multi-chip device assembly and mother-board applications. The selective dielectric and metallization topology is also applicable to 3D heat sink structure. |
