APPARATUS AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

摘要

Provided are an apparatus and a method for manufacturing a multilayer wiring board, by which the multilayer wiring board can be more efficiently and accurately manufactured. A manufacturing apparatus (1) is provided with a temporarily welding section (12) for performing temporary welding to a stacked body composed of the prescribed number of stacked wiring boards (A) and prepreg (B); and a hole making section (14) for making a hole on the stacked body and performing main welding. In the temporarily welding section (12), further temporary welding can be performed to the stacked body prepared by adding a new wiring board to the stacked body to which the temporary welding has been performed. Basically, such process can be repeated as many times as required. While such repeated process is performed, a hole is made by the hold making section (14).