摘要 |
<p>A method of fabricating a plurality of MEMS integrated circuits from a wafer having a MEMS layer formed on a frontside thereof and a polymer coating over said MEMS layer, said polymer coating having a plurality of frontside dicing streets defined therethrough, said method comprising the steps of: (a) releasably attaching a first holding means to said polymer coating; and (b) performing at least one operation on a backside of the wafer, said at least one operation including etching a plurality of backside dicing streets through the wafer, each backside dicing street meeting with a respective frontside dicing street, thereby providing the plurality of MEMS integrated circuits releasably attached to said first holding means, wherein each MEMS integrated circuit comprises a respective polymer coating.</p> |
申请人 |
SILVERBROOK RESEARCH PTY LTD;MCAVOY, GREGORY JOHN;SILVERBROOK, KIA;KERR, EMMA ROSE;BAGNAT, MISTY;LAWLOR, VINCENT PATRICK |
发明人 |
MCAVOY, GREGORY JOHN;SILVERBROOK, KIA;KERR, EMMA ROSE;BAGNAT, MISTY;LAWLOR, VINCENT PATRICK |