FLAME-RESISTANT RESIN COMPOSITIONS, COVERLAY FILMS AND FLEXIBLE PRINTED CIRCUIT BOARDS USING THE SAME

摘要

A flame-resistant resin composition is provided to ensure excellent fire retardant characteristic, adhesive force, bendability and heat resistance and to prevent environmental contamination by not using a halogen-based flame retardant. A flame-resistant resin composition comprises (A) an epoxy resin containing phosphorus; (B) a resol-type phenolic resin; and (C) a dimer modified polyamide resin. The epoxy resin containing phosphorus is selected from a group consisting of (i) a resin formed by reacting an OH group of a compound indicated as the chemical formula 1 and an epoxy group of an epoxy resin and (ii) a resin formed by reacting a hydrogen of a compound indicated as the chemical formula 2 and an epoxy group of an epoxy resin.