| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof, which can house a compact semiconductor element such as a semiconductor device of chip size in a substrate, moreover, is high in inspection efficiency. <P>SOLUTION: In a semiconductor device 1 which is constituted by housing a semiconductor chip 20 of wafer level package type in a substrate 10, a bump electrode 20b whose cross sectional shape is concave is provided on the semiconductor chip 20, on the semiconductor chip 20, a wiring substrate 30 in which a sharp-pointed electrode terminal 30c is provided is arranged, the sharp-pointed electrode terminal 30a is received in the concave portion of the bump electrode 20b and pressure-welded. Thereby, the semiconductor device constituted by housing the semiconductor package in the substrate 10 is actualized with lower cost and high reliability. <P>COPYRIGHT: (C)2009,JPO&INPIT |
