| 摘要 |
PROBLEM TO BE SOLVED: To improve production efficiency and compactness of the whole resin sealing device. SOLUTION: A strip-state film 151 cut in a predetermined size is used as a release film. The resin sealing device 100 is equipped with a removing mechanism 161 for removing the used strip-state film 151 from a resin-sealed molded article 152. The removing mechanism 161 is provided for a substrate loader/unloader 140 for holding the molded article 152 and taking it out of the resin sealing mold. COPYRIGHT: (C)2009,JPO&INPIT
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