| 摘要 |
An IC chip package production apparatus of this invention comprises a conveyance portion which conveys a film substrate, and an IC chip mounting portion which mounts IC chips on the film substrate. The IC chip mounting portion comprises a mounting roller, on the outer face of which are formed a chip holding groove and a suction-clamping hole, which mounts IC chips on the film substrate by holding IC chips and rotating; an IC chip supply portion, having a supply path which supplies a plurality of IC chips successively; and a linear feeder which, with one supply end of the supply path opposing the chip holding groove and suction-clamping hole, feeds IC chips from the supply end to the chip-holding groove. The production apparatus further comprises a thermal pressure-bonding portion which performs thermal pressure-bonding of IC chips and the film substrate; this thermal pressure-bonding portion has a tape with magnets and a magnetic tape on the conveyor path conveying the film substrate, which apply pressure to the film substrate on the conveyor path without stopping the motion, and a heat-application portion which applies heat to the film substrate on the conveyor path without stopping the motion.
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