| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of improving the manufacturing yield of the semiconductor devices and reducing loss of nondefective semiconductor chips. <P>SOLUTION: The characteristic inspection of a semiconductor chip mounted is performed at each time of lamination, and only when the semiconductor chip is determined to be nondefective, a new semiconductor chip is laminated on the semiconductor chip. <P>COPYRIGHT: (C)2009,JPO&INPIT |
