| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flame-retardant photosensitive resin composition which allows imidization at a lower temperature as compared with a conventional one, and which has small warpage and excels in flexibility, bendability, electric reliability and photosensitivity in a state where it is laminated as a photosensitive dry film resist on an FPC substrate or the like. <P>SOLUTION: The photosensitive resin composition comprises: (A) a polyimide precursor consisting of a constitutional unit represented by general formula (1) and a constitutional unit represented by a specific general formula; (B) a (meth)acrylate compound; (C) a photoreaction initiator; and (D) a phosphorus-containing flame retardant. <P>COPYRIGHT: (C)2009,JPO&INPIT |
