发明名称 HOUSING
摘要 PROBLEM TO BE SOLVED: To obtain a housing which prevents dew condensation on surfaces of equipment installed in the housing. SOLUTION: An apparatus includes: the housing consisting of an exterior housing 11 whose inside surface 11a has an emissivity smaller than that of an outside surface 11d thereof, and of an interior housing 12 whose outside surface 12a has an emissivity smaller than that of an inside surface 12b thereof wherein the interior housing 12 is installed in the exterior housing 11 with a gap between the exterior housing 11; and the equipment 13 installed in the interior housing 12. The apparatus also includes mounts 12v and 12w for holding the interior housing 12 in the exterior housing 11 wherein the mounts 12v and 12w are formed with a material having a thermal conductivity smaller than that of a material forming the exterior housing 11 and the interior housing 12. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008306142(A) 申请公布日期 2008.12.18
申请号 JP20070154457 申请日期 2007.06.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIBINO ATSUO
分类号 H05K5/02;H05K7/20 主分类号 H05K5/02
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