发明名称 LIGHT-EMITTING DEVICE, AND MANUFACTURING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting device and a manufacturing method therefor which suppress a characteristic deterioration to improve reliability. <P>SOLUTION: According to the light-emitting device and the manufacturing method therefor, a light-emitting semiconductor chip having a light-emitting unit with a protective film is mounted on the light-emitting device. The protective film includes a first dielectric film made of an oxynitriding aluminum, a second dielectric film made of a silicon nitride or an oxynitriding aluminum, and a third dielectric film made of an oxide or fluoride. The first dielectric film is positioned to be closer to the light-emitting unit than the second dielectric film, and the second dielectric film is positioned to be closer to the light-emitting unit than the third dielectric film. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008305848(A) 申请公布日期 2008.12.18
申请号 JP20070149422 申请日期 2007.06.05
申请人 SHARP CORP 发明人 KAWAGUCHI YOSHINOBU;KAMIKAWA TAKESHI
分类号 H01L33/44;H01L33/48;H01S5/022 主分类号 H01L33/44
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