| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high density fine line mounting structure and manufacturing method of the same. <P>SOLUTION: Two plate materials that are similar in the structure are included and the two plate materials are combined with a dielectric resin film. After combination, semiconductor elements in the two plate materials are respectively located in the opposite sides. These two plate materials are respectively constituted with an ultra-fine line circuit layer, an insulating layer provided on the same flat surface, and the semiconductor element provided on the ultra-fine line circuit layer. A part not shielded by solder mask bottom in the ultra-fine line circuit layer of the two plate materials is filled with a solder ball as the continuous connection pad or is electrically connected continuously with another semiconductor element by utilizing the solder ball. In this structure, in view of forming the ultra-fine line circuit layer with an electrolytic plating process without use of the etching means, a carrier body and a metal shielding layer required to form the ultra-fine line circuit layer are removed during the manufacturing process or at the ending time of manufacturing process. As described above a layout space can be enlarged to realize high density structure. <P>COPYRIGHT: (C)2009,JPO&INPIT |
