| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide plasma processing equipment which reduces shortened lifetime of a dielectric by keeping reactive products generated by the plasma processing from reaching a plasma generating region and the dielectric, and which improves reliability and operating rates. <P>SOLUTION: The plasma processing equipment performs a process to excite a process gas and expose a substrate being processed to the plasma arising at a plasma generating region. A gas discharge means emits the process gas toward the lower side at a given angle to shunt the gas flow into a first vortex gas flow passing through the dielectric and the plasma generating region instead of passing through the top surface of the substrate being processed and a second vortex gas flow passing through the top surface of the substrate being processed instead of passing through the dielectric and the plasma generating region. <P>COPYRIGHT: (C)2009,JPO&INPIT |
