发明名称 SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate manufacturing method which can reuse a peeled flexible substrate when repairing a flexible substrate and rigid substrate connected through an adhesive. SOLUTION: A conductive adhesive 5, which remains on a surface of a first electrode 2 deposited on a rigid substrate 1 that a flexible substrate is peeled, is scratched by a removing component 10 immersed with a solvent in the longitudinal direction H of the first electrode 2, thereby, the conductive adhesive 5 remained on the surface of the first electrode 2 is removed. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008306053(A) 申请公布日期 2008.12.18
申请号 JP20070152904 申请日期 2007.06.08
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAMAMOTO MASAMICHI;NAKATSUGI KYOICHIRO;SATO KATSUHIRO;OKUDA YASUHIRO
分类号 H05K3/36 主分类号 H05K3/36
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