发明名称 Electronic Structures Including Barrier Layers Defining Lips
摘要 Forming an electronic structure may include forming a seed layer on a substrate, and forming a mask on the seed layer. The mask may include an aperture therein exposing a portion of the seed layer, and a barrier layer may be formed on the exposed portion of the seed layer. A bump may be formed on the barrier layer, and the mask may be removed. In addition, portions of the seed layer may be selectively removed using the barrier layer as an etch mask.
申请公布号 US2008308931(A1) 申请公布日期 2008.12.18
申请号 US20080194999 申请日期 2008.08.20
申请人 UNITIVE INTERNATIONAL LIMITED 发明人 RINNE GLENN A.;MIS J. DANIEL
分类号 H01L23/498;H01L21/44;H01L21/60;H01L23/485;H05K3/06;H05K3/24 主分类号 H01L23/498
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