METHOD AND APPARATUS FOR WAVE SOLDERING AN ELECTRONIC SUBSTRATE
摘要
<p>A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to deliver an inert gas around the first solder wave. Other embodiments and methods of wave soldering are further disclosed.</p>
申请公布号
WO2008154117(A1)
申请公布日期
2008.12.18
申请号
WO2008US63849
申请日期
2008.05.16
申请人
ILLINOIS TOOL WORKS INC.;SZYMANOWSKI, RICHARD A.;KIRBY, KENNETH R.