发明名称 |
METHOD IN MANUFACTURING OF CIRCUIT BOARDS |
摘要 |
Method for connecting the conductive surfaces of circuit boards, especially a circuit board equipped with at least two conductive surfaces separated by an insulator layer and with holes, or for creating conductors on a board in a manner that conducts electricity. In the method, a metal or metal alloy, in a powder form, is fed into and the powder is sintered using a laser in order to create a unified conductive structure. |
申请公布号 |
CA2690198(A1) |
申请公布日期 |
2008.12.18 |
申请号 |
CA20082690198 |
申请日期 |
2008.05.29 |
申请人 |
FINNISH ENVIRONMENT TECHNOLOGY OY |
发明人 |
SALMINEN, ANTTI;HOLAPPA, RAUNO |
分类号 |
H05K3/46;H05K3/02;H05K3/10 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|