发明名称 HIGH-CONTACT STRUCTURE FOR SOLID-PARTICLE, HIGH-CONTACT STRUCTURE BASE FOR SOLID PARTICLE, AND PROCESSES FOR PRODUCING THESE
摘要 A structure having strong contact with solid particles comprising an assembly formed by secondary aggregation which is further aggregation of aggregates each formed by primary aggregation of primary particles each made of a metal and/or a metal oxide, wherein an average primary particle diameter of the primary particles is in a range from 1 to 100 µm, and, among void pores formed by the aggregates, a volume of void pores having pore diameters in a range within ±50% away from an average void pore diameter of the void pores is equal to or above 60% of a total volume of the void pores.
申请公布号 EP2002892(A2) 申请公布日期 2008.12.17
申请号 EP20070739757 申请日期 2007.03.27
申请人 KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO 发明人 KAYAMA, TOMOYUKI;BANNO, KOUZI
分类号 B01J35/10;B01D53/94;B01J23/66;B01J35/02;B01J37/02;B01J37/03;B01J37/08;B01J37/16;F01N3/02 主分类号 B01J35/10
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