发明名称 |
BAD FUER ELEKTRODENLOSE VERKUPFERUNG |
摘要 |
<p>Bath contg. a water-sol. Cu salt, a cpd. forming a complex with Cu, an alkali metal hydroxide and formaldehyde, is improved by the addn. of a sulphite, pref. 1-10 g/l or Na2SO3, K2SO3, (NH4)2SO3 or NaH2O3. The sulphite inhibits noncatalyst reactions which otherwise occur in the bulk of the soln. at higher concns. and temps. so that the process can be intensified.</p> |
申请公布号 |
DE2232277(A1) |
申请公布日期 |
1973.01.18 |
申请号 |
DE19722232277 |
申请日期 |
1972.06.30 |
申请人 |
HITACHI, LTD., TOKIO |
发明人 |
HARADA, FUMIO, YOKOHAMA;INOUE, HAJIME, KAMAKURA;OIKAWA, SYOJI;KATO, KAZUNOBU |
分类号 |
C23C18/40;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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