发明名称 BAD FUER ELEKTRODENLOSE VERKUPFERUNG
摘要 <p>Bath contg. a water-sol. Cu salt, a cpd. forming a complex with Cu, an alkali metal hydroxide and formaldehyde, is improved by the addn. of a sulphite, pref. 1-10 g/l or Na2SO3, K2SO3, (NH4)2SO3 or NaH2O3. The sulphite inhibits noncatalyst reactions which otherwise occur in the bulk of the soln. at higher concns. and temps. so that the process can be intensified.</p>
申请公布号 DE2232277(A1) 申请公布日期 1973.01.18
申请号 DE19722232277 申请日期 1972.06.30
申请人 HITACHI, LTD., TOKIO 发明人 HARADA, FUMIO, YOKOHAMA;INOUE, HAJIME, KAMAKURA;OIKAWA, SYOJI;KATO, KAZUNOBU
分类号 C23C18/40;(IPC1-7):C23C3/02 主分类号 C23C18/40
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