| 发明名称 |
MANUFACTURING A SEMICONDUCTOR DEVICE |
| 摘要 |
The invention relates to a method of manufacturing a semiconductor device in which a conductive pattern of a semiconductor body which is, for example, reinforced, is connected to a conductive pattern of a substrate by so-called "face-down-bonding. |
| 申请公布号 |
AU3853972(A) |
申请公布日期 |
1973.08.09 |
| 申请号 |
AU19720038539 |
申请日期 |
1972.02.02 |
| 申请人 |
PHILIPS@ GLOEILAMPENFABRIEKEN., N. V. |
发明人 |
WOLTER GEPPIENUS GELLING |
| 分类号 |
H01B3/40;H01L21/56;H01L21/60 |
主分类号 |
H01B3/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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