| 摘要 |
The present invention relates to solutions used for chemical dissolution treatment such as, pickling, etching, chemical polishing, etc., of metallic materials. In such a treatment, however, where hydrogen peroxide is used as an oxidizing agent, a considerable excess of the agent is required due to low efficiency. On the other hand, when chloride ions are contained in the solution, the dissolution rate of metallic materials is remarkably decreased. The present invention has overcome the above difficulties by using a solution for chemical dissolution treatment of metallic materials containing hydrogen peroxide, an acid and at least one of an alcohol polyoxyethylene ether, an alkylsulfonic acid, an alkyl hydrogen phosphate, an alkyl hydrogen phosphite, an alkyl hydrogen sulfate and their salts.
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