| 摘要 |
<p>The process involves applying a silver layer to the base using an offset printing technique whereby the printing plate is e.g. a flexible printed circuit which is to be applied to the printing roller or is a rubber profile or a lead mould onto which the silver is transferred by a further roller. This process has not been favoured in the past because a definable layer thickness could not be guaranteed. However since in this case only limited current loadings apply, the offset technique can be employed advantageously for applying silver layers.</p> |
