Activation of surfaces intended for electroless plating

摘要

Surfaces intended to be electrolessly metal plated, for instance the surfaces of through holes on through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanol-modified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.