发明名称 |
Electroplating device and method |
摘要 |
There is described an electroplating method and device for accomplishing the same whereby metal plating is disposed on a wire as said wire moves along an established path through the device. Relatively high speed deposition is achieved as a result of intermittent positioning of the device's inlet and outlet ports within the electrically conductive means of the device. The wire to be plated is established at a negative electrical potential and moved through said electrically conductive means. Accordingly, the conductive means is adapted for providing the electrolyte therein with a positive electrical potential to thereby provide the desired deposition.
|
申请公布号 |
US3994786(A) |
申请公布日期 |
1976.11.30 |
申请号 |
US19750586556 |
申请日期 |
1975.06.13 |
申请人 |
GTE SYLVANIA INCORPORATED |
发明人 |
MARKS, RICHARD LEE;EDSON, GWYNNE ISAAC |
分类号 |
C25D7/06;(IPC1-7):C25D7/06;C25D17/00 |
主分类号 |
C25D7/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|