发明名称 Integrated SC circuit manufacture - involves method for making connections to selected zones on circuit surface (NL141276)
摘要 <p>A first insulating layer (34) is produced covering the circuit surface. Holes are then made in it for baring selected zones. A second insulating layer (44) covering the first and filling the holes is then produced. The etching rate for the second layer is lower than that of the first. Etching means are applied to the parts of second layer (44) covering the filled holes in the first layer, so that the selected zones are again bared. Conducting traces are then produced on the second layer, which enter into the holes and make contact with selected zones.</p>
申请公布号 FR2314581(A1) 申请公布日期 1977.01.07
申请号 FR19760017683 申请日期 1976.06.11
申请人 NATIONAL CASH REGISTER CY 发明人
分类号 H01L29/78;H01L21/00;H01L21/306;H01L21/316;H01L21/3205;H01L21/336;H01L23/485;H01L29/00;(IPC1-7):01L21/88 主分类号 H01L29/78
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