Improvements in or relating to mounting arrangements for semiconductor devices

摘要

872,894. Mounting arrangements for semiconductor devices. GENERAL ELECTRIC CO. Ltd. Oct. 5, 1959 [Oct. 13, 1958], No. 32592/58. Class 37. A mounting arrangement for semi-conductor devices, e.g. of the kind described in Specification 859,849, having a base electrode 3 constituted by a block of high thermal and electrical conductivity arranged to be cooled by fluid, comprises an insulating support 4 incorporating one or more ducts 5 and means, e.g. metallic inserts 7, for directing cooling fluid from a duct 5 on to the base electrode and for returning the fluid to the same, or a further duct. As shown, a semi-conductor device 1, together with a metallic insert 7, is mounted in an aperture 6 in the support 4, the metallic insert 7 also serving as an electrical connection to the base electrode. A power rectifier assembly may comprise a number of devices 1, each having a germanium rectifier element and a pair of opposed electrodes including copper base electrode 3, mounted along the length of a bar 4 of rectangular or elliptical cross-section or arranged in a circle on a supporting disc, the support being extruded or cast from a suitable resin or formed in two halves secured together. The devices 1 may be mounted alternately on opposite sides of the support 4 for ease in connecting the devices in series. Instead of being removable as shown, the inserts 7 may be moulded or cast in the support 4, Fig. 3 (not shown). Also the support may comprise two parallel ducts, the passages 12, 13 in the inserts 7 being transverse to the lengths of the ducts.