发明名称 METHOD AND APPARATUS FOR CONTROL OF ELECTROLESS PLATING SOLUTIONS
摘要 A copper-plating bath operating without an external power supply can be controlled automatically by measuring, with the aid of two electrodes, of which one is positioned in bath fluid and serves as the deposition electrode and the other serves as the reference electrode, the mixed potential arising between the electrodes and employing this measurement for controlling and/or regulating one or more bath parameters.
申请公布号 ZA7705495(B) 申请公布日期 1978.07.26
申请号 ZA19770005495 申请日期 1977.09.13
申请人 KOLLMORGEN TECHN CORP 发明人 FUNK C;KARAS J;ZEBLISKY R
分类号 C23C18/40;C23C18/16 主分类号 C23C18/40
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