发明名称 |
Apparatus for cutting up hard and brittle material |
摘要 |
A gang saw is used for cutting up hard and brittle material, particularly semiconductor material, in which saw there is a reciprocating movement of workpiece with a large amplitude and low frequency and an additional vibrating motion of the sawblades in the same direction with a low amplitude and high frequency permitting very thin wafers of large area and a plane cutting surface to be prepared.
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申请公布号 |
US4105012(A) |
申请公布日期 |
1978.08.08 |
申请号 |
US19770843417 |
申请日期 |
1977.10.19 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HINI, PAUL;FORSTER, HELMUT |
分类号 |
B23D51/04;B28D5/04;(IPC1-7):B28D1/02 |
主分类号 |
B23D51/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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