发明名称 |
Machine for changing the spacing of a plurality of wafers |
摘要 |
A machine for changing the spacing of a plurality of wafers comprises a plurality of wafer receiving surfaces initially having a first spacing associated therewith. The wafer receiving surfaces cooperatively engage with means which, when activated, move the plurality of wafer receiving surfaces so that they have a second spacing associated therewith.
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申请公布号 |
US4108323(A) |
申请公布日期 |
1978.08.22 |
申请号 |
US19770837419 |
申请日期 |
1977.09.28 |
申请人 |
RCA CORPORATION |
发明人 |
SHAMBELAN, ROBERT CHARLES;LINDSLEY, CHARLES WESLEY |
分类号 |
B65G65/00;H01L21/677;(IPC1-7):B65G65/04 |
主分类号 |
B65G65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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