发明名称 |
PELLETIZING METHOD OF SEMICONDUCTOR WAFER |
摘要 |
<p>PURPOSE:To make possible the use of a sheet having no adhesive property and facilitate peeling by placing a semiconductor wafer provided with scribe lines and a spreadable sheet covering this on a base having suction holes and pelletizing the wafer while maintaining between the sheet and wafer under reduced pressure through the suction holes.</p> |
申请公布号 |
JPS5412564(A) |
申请公布日期 |
1979.01.30 |
申请号 |
JP19770077579 |
申请日期 |
1977.06.29 |
申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
OZAWA SHIGERU;NAGATOMI TSUTOMU |
分类号 |
H01L21/301;H01L21/302 |
主分类号 |
H01L21/301 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|