发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To soften the heat stress which is applied to the bonding part between the pellet and the copper lead as well as between the pellet and the cooling fin, by securing an OMEGA-shape between the copper lead and the insulating plate of the input terminal and utilizing the difference of the heat expansion coefficient between the copper lead and the insulating plate.
申请公布号 JPS5428568(A) 申请公布日期 1979.03.03
申请号 JP19770094176 申请日期 1977.08.08
申请人 HITACHI LTD 发明人 SAKAGAMI TADASHI;NARITA KAZUTOYO;KAWASAKI NOBORU
分类号 H01L25/07;H01L23/48 主分类号 H01L25/07
代理机构 代理人
主权项
地址