发明名称 ATTACHMENT METHOD OF SEMICONDUCTOR PELLET
摘要 PURPOSE:To obtain the suitable paste material by mixing the composite minute ball of silver, copper and gold, the alloy of these metals, the plated substance into the silver paste of 4-20wt% with good churning. CONSTITUTION:The ball of silver or the like featuring 10-80mum is mixed into the silver paste by about 4-20wt% and then stirred up well. The paste is applied about 10-30mum to adhere and dry the pellet, thus hardening the epoxy resin. In this method, the crack occurrence can be reduced greatly at the paste layer, and the crack if caused is negated by the peripheral internal stress of the small ball substance and thus does not grow further.
申请公布号 JPS5469065(A) 申请公布日期 1979.06.02
申请号 JP19770135722 申请日期 1977.11.14
申请人 发明人
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
代理机构 代理人
主权项
地址
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