| 摘要 |
<p>PURPOSE:To fasten an external lead pin firmly by pressure-inserting a head-fitted external lead pin into a hole provided on a laminated plate and caulking it from the opposite side in a semiconductor device formed by using a copper-lined laminated plate to be used in a printed circuit. CONSTITUTION:Along both edges of glass-based epoxy resin laminated plate 1, a hole in which an external lead pin is to be fitted is provided. Conductor pattern 6 is formed in the neighborhood of the hole. Sn-plated copper ply wire is processed in advance into a lead pin provided with head 7, pressure-inserting part 8 and projected part 9. Next, pressure-inserting part 8 is caulked, and this is fixed to laminated plate 1 via conductor pattern 6 and Au-plated layer 10. Since the external lead pin is fixed so as to cover both openings of the hole, no loosening of the external lead pin or peeling of the conductor pattern occurs.</p> |
