| 摘要 |
PURPOSE:To prevent the short circuit troubles of wiring by providing projections to leads which are connected with the element mounting part of a lead frame at positions near the surface of sealing resin projecting to the element side. CONSTITUTION:The tips of plural leads 11 are disposed near an element mounting part 12 and projections 19 are provided to the holding parts 13 on both sides of the element mounting part 12. The projections 19 which project to the element mounting surface side and are formed by pressing are made near resin sealed edges. After brazing and wiring 17 an element 14, this lead frame is put in a mold 15. If the projections 19 are set at the ends of the cavity 16 of the mold 15, they are pressed by the mold 15 and the mounting part 12 goes down, therefore, the wiring 17 does not contact the edge of the element 14 or the mounting part 12. Resin is injected in this state. By so constructing, the short-circuiting of wiring can be prevented by the small deformation of a part of the lead frame. |
